Bonding compounds are often used as a means of protecting electrical terminations from the moisture and other contaminates. Furthermore, proper adhesion of potting compounds can have a positive impact on component durability to vibration and mechanical shocks. The bondability of insulation to potting compounds test evaluates the adhesion to the wire/cable insulation.
In this test, the potting compound is cured on the wire/cable specimen. Once cured, the bondability of the insulation to potting compounds is evaluated by a mechanical pull test.
Parameters that can be changed for this test include:
- Potting compounds
- Sample preparation method
- Curing time
- Curing temperature