Bondability of Insulation to Potting Compounds

Bonding compounds are often used as a means of protecting electrical terminations from the moisture and other contaminates. Furthermore, proper adhesion of potting compounds can have a positive impact on component durability to vibration and mechanical shocks. The bondability of insulation to potting compounds test evaluates the adhesion to the wire/cable insulation.

In this test, the potting compound is cured on the wire/cable specimen. Once cured, the bondability of the insulation to potting compounds is evaluated by a mechanical pull test.

Parameters that can be changed for this test include:

• Potting compounds
• Sample preparation method
• Curing time
• Curing temperature